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315 open listings · Page 10 of 13
Roles posted by organizations here, alongside roles we found on employers’ own careers sites. Crawled roles say so on the card and send you to the employer to apply. Only show organizations on Career App
Boeing
Listed on Boeing’s careers site · Apply there ↗
NVIDIA
Santa Clara, CA
Listed on NVIDIA’s careers site · Apply there ↗
KLA-Tencor
Milpitas, CA
Listed on KLA-Tencor’s careers site · Apply there ↗
FLIR Systems
Huntsville, AL
Listed on FLIR Systems’s careers site · Apply there ↗
Intel
3 locations
Listed on Intel’s careers site · Apply there ↗
Broadcom Inc.
2 locations · $108,000 – $172,800
This is an ASIC physical design role requiring expertise across synthesis, place and route, timing, power, and signal integrity to drive large complex chip implementations to closure. It suits experienced engineers who can lead multiple design disciplines and work independently on cutting-edge technology nodes.
Listed on Broadcom Inc.’s careers site · Apply there ↗
Micron Technology
3 locations
Listed on Micron Technology’s careers site · Apply there ↗
NVIDIA
Listed on NVIDIA’s careers site · Apply there ↗
KLA-Tencor
Milpitas, CA
Listed on KLA-Tencor’s careers site · Apply there ↗
FLIR Systems
Ridge, NY
Listed on FLIR Systems’s careers site · Apply there ↗
Intel
2 locations
You will lead the physical design of high-performance CPU blocks through the full chip manufacturing flow, from logic synthesis to final signoff, optimizing for speed, power, and area. This role suits experienced chip designers who want to work on next-generation Intel processors in a mentoring capacity.
Listed on Intel’s careers site · Apply there ↗
Boeing
El Segundo, CA · $138,550 – $224,250
Boeing seeks a digital electronics engineer to design cutting-edge circuitry for satellite systems, working within a collaborative space where prototyping happens on-site. This role suits experienced engineers ready to lead technical teams and drive innovation in aerospace digital products.
Listed on Boeing’s careers site · Apply there ↗
Broadcom Inc.
2 locations · $108,000 – $172,800
A staff-level circuit design role developing memory compilers and custom macros for advanced process nodes, involving transistor-level simulation, layout integration, and characterization. Suits experienced memory design engineers with strong backgrounds in circuit behavior, device physics, and silicon validation.
Listed on Broadcom Inc.’s careers site · Apply there ↗
Micron Technology
Folsom, CA
Listed on Micron Technology’s careers site · Apply there ↗
KLA-Tencor
Milpitas, CA
Listed on KLA-Tencor’s careers site · Apply there ↗
FLIR Systems
Goleta, CA
Listed on FLIR Systems’s careers site · Apply there ↗
NVIDIA
Santa Clara, CA · $168,000 – $310,500
NVIDIA is hiring a senior engineer to architect and implement design-for-test solutions for their next-generation AI chips, working across the full silicon lifecycle from design through post-silicon validation. This role suits someone with deep DFT expertise and SoC design experience who enjoys mentoring others and collaborating across hardware and software teams.
Listed on NVIDIA’s careers site · Apply there ↗
Intel
Full-time · Hillsboro, OR · $141,910 – $269,100
This role involves owning the physical design and implementation of CPU core blocks, executing the full RTL-to-GDS flow including synthesis, place-and-route, and timing closure. It suits experienced hardware engineers with deep expertise in digital design tools and a track record of shipping complex silicon at advanced process nodes.
Listed on Intel’s careers site · Apply there ↗
Boeing
Full-time · North Charleston, SC · $103,700 – $171,350
Boeing is hiring experienced or senior design engineers for its 787 aircraft interiors and payload systems, covering everything from cabin design to cargo systems and regulatory certification. This role suits engineers with aerospace background who want to work across the full product lifecycle from customer configuration through production.
Listed on Boeing’s careers site · Apply there ↗
Broadcom Inc.
$127,100 – $203,400
A principal-level IC design role focused on high-performance DRAM interface architecture and system-on-chip integration at a major semiconductor company. Suited for experienced engineers with deep expertise in memory subsystem design, SOC architecture, and the ability to lead cross-functional technical teams through complex design trade-offs.
Listed on Broadcom Inc.’s careers site · Apply there ↗
Micron Technology
Listed on Micron Technology’s careers site · Apply there ↗
KLA-Tencor
2 locations
Listed on KLA-Tencor’s careers site · Apply there ↗
FLIR Systems
Orlando, FL
Listed on FLIR Systems’s careers site · Apply there ↗
NVIDIA
Full-time · Santa Clara, CA · $116,000 – $189,750
This role involves designing high-performance, power-efficient hardware building blocks (RTL) for GPUs and SoCs used in AI, graphics, and autonomous systems. It suits engineers with 2+ years of digital design experience who are comfortable with Verilog, synthesis flows, and collaborating across large verification and silicon teams.
Listed on NVIDIA’s careers site · Apply there ↗
Boeing
Full-time · El Segundo, CA · $90,950 – $182,850
Boeing's Defense, Space & Security division seeks structural and payload design engineers to develop satellite and spacecraft hardware using CAD tools, working with composite materials and ground support equipment throughout the product lifecycle. This role suits engineers with aerospace or mechanical backgrounds who want hands-on design work in space hardware, from concept through production support.
Listed on Boeing’s careers site · Apply there ↗