$106,000 – $145,000
Listed on Samsung Semiconductor’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Samsung is hiring a process engineer to lead the development and manufacturing integration of advanced copper-to-copper wafer bonding technology for stacked image sensors. This role suits someone with deep semiconductor manufacturing experience who can drive yield improvements and manage complex process interactions in a high-stakes fab environment.
Our summary, not Samsung Semiconductor’s wording. The full posting is on their site.
What they ask for
Required
- Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
- 5+ years Far BEOL process or module integration experience in semiconductor manufacturing
- 3+ years bonding process experience
- Expert understanding of process flow interactions between process, yield, product performance and reliability
Nice to have
- 10+ years process or module integration experience
- Prior knowledge of fab unit processes including lithography, etch, diffusion, thin films deposition, wet cleans and CMP