$127,100 – $203,400
Listed on Broadcom Inc.’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
A principal-level IC design role focused on high-performance DRAM interface architecture and system-on-chip integration at a major semiconductor company. Suited for experienced engineers with deep expertise in memory subsystem design, SOC architecture, and the ability to lead cross-functional technical teams through complex design trade-offs.
Our summary, not Broadcom Inc.’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- 12+ years of experience with a Bachelor's in EE, CE, or CS, or 10+ years with a Master's degree in Engineering
- High-performance DRAM interface design expertise
- SOC architecture knowledge and understanding of memory interface integration
- HDL proficiency in Verilog, VHDL, or SystemVerilog
- Physical implementation and timing closure experience with process variation
- Signal Integrity understanding and design impact analysis
- Legal authorization to work in the US
Nice to have
- Cross-functional collaboration and communication skills
- Cloud-based documentation experience
- Data-driven decision-making ability
- Ability to consult with layout engineers on area and performance optimization