Listed on Micron Technology’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role leads the physical design of Micron's high-bandwidth memory chips from initial schematic through final manufacturing data, owning placement, routing, timing closure, and power delivery across advanced process nodes. It suits experienced IC designers comfortable driving complex multi-team efforts in memory-centric designs and learning HBM-specific architecture if not already expert in it.
Our summary, not Micron Technology’s wording. The full posting is on their site.
What they ask for
Required
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field
- 7+ years hands-on advanced-node physical design experience
- Tape-out experience on HBM, DRAM, or large memory-centric designs
- Expertise in floorplanning and hierarchical timing closure
- Power integrity and thermal design experience
- Physical signoff knowledge for advanced nodes
- Expert-level Cadence Innovus or Synopsys ICC2/Fusion Compiler
- Strong PrimeTime STA proficiency
- RedHawk or equivalent power integrity tool experience
- Calibre DRC/LVS and foundry signoff flow familiarity
Nice to have
- Direct HBM2E, HBM3, or HBM3E product experience
- TSV-based design and micro-bump layout knowledge
- Die-to-die interface and wide parallel bus experience
- Advanced packaging understanding (2.5D interposer, chiplets)
- FinFET and sub-10nm node experience
- Tcl or Python scripting for physical design automation