$208,000 – $416,000
Listed on Micron Technology’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role leads the architectural design of next-generation DRAM memory systems at Micron, influencing decisions across silicon, packaging, and platform interfaces. It suits an experienced semiconductor architect with deep DRAM expertise who can bridge technical domains and shape long-term product strategy.
Our summary, not Micron Technology’s wording. The full posting is on their site.
What they ask for
Required
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field
- Extensive professional experience with DRAM architecture or advanced semiconductor builds
- Experience translating system or customer requirements into architectural solutions
- Experience collaborating across silicon, packaging, systems, and platform domains
- AI/LLM/ML knowledge and practical use
Nice to have
- Advanced degree (MS or PhD) in engineering or computer science
- Experience defining RAS, reliability, or telemetry features in production designs
- Direct customer or ecosystem partner engagement experience
- Technical leadership track record across multiple projects
- Understanding of performance, power, signal integrity, thermal, and cost trade-offs