A
$145,000 – $225,000
Listed on Astranis’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Astranis is hiring a senior mechanical engineer to design and optimize enclosures and housings for spacecraft electronics and RF components, managing everything from concept through environmental testing. This role suits someone with deep electronics packaging expertise who enjoys solving complex problems at the intersection of mechanical, thermal, and RF engineering in a high-reliability space environment.
Our summary, not Astranis’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Bachelor's or Master's degree in mechanical or aerospace engineering or equivalent
- 5+ years of mechanical design experience in electronics packaging, RF packaging, or enclosure design
- Proficiency in 3D CAD (SolidWorks, NX, or Creo)
- Strong fundamentals in mechanical design, structural design, and thermal management for PCBAs and enclosures
- Practical knowledge of RF isolation and EMI/EMC mitigation in mechanical enclosures
- Experience with GD&T, tolerance analysis, engineering drawings, and design for manufacturability
- Hands-on experience with hardware prototyping, thermal interface materials, precision machining, and assembly processes
- U.S. citizenship, lawful permanent residency, or refugee/asylee status
Nice to have
- Experience designing high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings
- Experience with mechanical or thermal FEA (ANSYS, Femap/NX Nastran, Thermal Desktop)
- Experience designing electronics enclosures for radiation and vacuum environments
- Experience designing hardware to withstand severe launch vibration, shock, and thermal cycling
- Hands-on experience with environmental testing (TVAC, vibration/shaker tables, thermal chambers, EMI/EMC chambers)
- Experience designing chip and wire RF housings for integrated antenna feed systems