A
$110,000 – $160,000
Listed on Astranis’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Design and analyze mechanical enclosures for spacecraft electronics and RF components, solving challenges at the intersection of thermal, electrical, and electromagnetic engineering. This role suits engineers with 2+ years of electronics packaging experience who want to work on space-grade hardware with a team building operational satellites.
Our summary, not Astranis’s wording. The full posting is on their site.
Skills this role names
- ANSYS
- Creo
- Finite Element Analysis (FEA)
- Geometric Dimensioning and Tolerancing (GD&T)
- Siemens NX
- SolidWorks
- Thermal Management
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What they ask for
Required
- Bachelor's or Master's degree in mechanical or aerospace engineering or equivalent
- 2+ years of mechanical design experience in electronics packaging, RF packaging, or enclosure design
- Proficiency in 3D CAD (SolidWorks, NX, or Creo)
- Strong fundamentals in mechanical design, structural design, and thermal management for PCBAs
- Knowledge of RF isolation techniques and EMI/EMC mitigation strategies
- Experience with GD&T, tolerance analysis, engineering drawings, and design for manufacturability
- Hands-on experience with hardware prototyping, thermal interface materials, precision machining, and assembly
Nice to have
- Experience designing high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings
- Experience with mechanical or thermal FEA tools
- Experience designing electronics enclosures for radiation and vacuum environments
- Experience designing hardware for launch vibration, shock, and thermal cycling environments
- Hands-on environmental testing experience (TVAC, vibration, thermal, EMI/EMC chambers)
- Experience designing chip and wire RF housings for integrated antenna feed systems