FS
$141,900 – $189,200
Listed on FLIR Systems’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
A technical leadership role focused on optimizing manufacturing yields and process integration for advanced infrared detector and thermal imaging devices. This position suits engineers with deep expertise in microbolometer fabrication, MEMS processing, and failure analysis who thrive on cross-functional collaboration and data-driven problem-solving.
Our summary, not FLIR Systems’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Master's degree in STEM field or equivalent work experience
- 7+ years in yield engineering, process integration, or device engineering
- Direct experience with infrared detectors, thermal imaging systems, microbolometers, or MEMS devices
- US Citizen or PERM Resident
- Microbolometer MEMS fabrication knowledge
- Wafer foundry functionality and process integration understanding
- Vacuum technology concepts, materials, and equipment knowledge
- Photolithography processes and equipment familiarity
- ROIC-to-detector hybridization experience
- Wafer bonding, dicing, and release steps experience
- MEMS processing and thin film expertise
- Root cause analysis and system-level thinking capabilities
Nice to have
- Vacuum packaging, wafer bonding, and hermetic sealing familiarity
- Prior ownership of an IR technology node or product family
- Six Sigma Green Belt or Black Belt certification