$99,030 – $188,890
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Intel seeks an engineer to develop and optimize assembly packaging equipment and processes for semiconductor manufacturing, working with Design of Experiments and statistical methods to improve efficiency and product reliability. This role suits candidates with materials, mechanical, or related engineering backgrounds who want to contribute to advanced manufacturing technology at scale.
Our summary, not Intel’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- US Citizenship
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years relevant experience, OR Master's degree with 1+ years experience, OR PhD
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE)
Nice to have
- Lead technical innovation and manage complex time-sensitive projects
- High-volume manufacturing experience including equipment troubleshooting and change qualification
- Understanding of semiconductor fabrication processes and packaging technologies
- Familiarity with equipment install and qualification
- Experience optimizing procedures or designs for safety, quality, or cost-effective manufacturability