Listed on Micron Technology’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role leads the development and optimization of dry etch processes for advanced DRAM manufacturing at Micron's new Boise fab, mentoring engineers and driving technical innovation across cross-functional teams. It suits seasoned process engineers with deep expertise in plasma etch mechanisms and semiconductor manufacturing who are ready to shape next-generation memory technology at scale.
Our summary, not Micron Technology’s wording. The full posting is on their site.
Skills this role names
Log in to see which of these are already on your profile.
What they ask for
Required
- Ph.D. or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
- Minimum 10 years of hands-on dry etch process development experience
- Proven track record of technical leadership in semiconductor process engineering
- Deep understanding of plasma etch mechanisms, process control, and defect mitigation
- Experience with advanced etch tools and process characterization techniques
- Strong analytical, problem-solving, and communication skills
- Ability to lead cross-functional teams and manage complex projects
Nice to have
- Experience with high aspect ratio etching, critical dimension control, and selectivity challenges in DRAM
- Familiarity with data analytics, DOE methodologies, and SPC tools
- Knowledge of integration challenges in sub-20nm DRAM nodes
- Experience and/or interest in developing Agentic AI workflows into current or future processes