$180,770 – $255,200
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role develops and optimizes die-to-wafer hybrid bonding processes and equipment for Intel's advanced semiconductor packaging technologies. It suits experienced process or equipment engineers with deep expertise in bonding, wafer joining, or similar advanced packaging domains who can lead development programs and drive manufacturing improvements.
Our summary, not Intel’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field plus 9+ years experience (or Master's plus 6+ years, or PhD plus 4+ years)
- 5+ years industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing
Nice to have
- Experience leading first-of-a-kind process or equipment development programs
- Experience introducing new hybrid bonding platforms or manufacturing capabilities
- Knowledge of bond interface defect mechanisms and failure modes
- Experience with alignment-sensitive manufacturing and overlay optimization
- Experience with process characterization and defect inspection techniques
- Experience improving equipment capability and throughput in manufacturing
- Experience collaborating with external equipment suppliers and materials vendors
- Experience transferring technology from development to manufacturing