$85,200 – $162,500
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Intel seeks a Module Engineer to design and optimize semiconductor packaging assembly processes and equipment for their foundry business. This role suits engineering graduates or experienced professionals with background in mechanical, materials, or chemical engineering who want to work on cutting-edge packaging technology in a manufacturing environment.
Our summary, not Intel’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- US Citizenship
- Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or STEM field with 1+ years experience OR Master's degree in related field OR Associate degree with 12+ years engineering experience
- 6+ months experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
Nice to have
- Prior experience in semiconductor manufacturing environment
- Experience with semiconductor packaging processes including assembly, materials, or reliability engineering in foundry context