Listed on Micron Technology’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
A Principal Engineer role shaping advanced semiconductor packaging technology roadmaps and investment priorities at Micron's Boise campus. This suits experienced packaging technologists who can balance technical innovation with business strategy and influence senior leadership on competitive positioning.
Our summary, not Micron Technology’s wording. The full posting is on their site.
What they ask for
Required
- Over 5 years in semiconductor advanced packaging
- BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or equivalent
- Deep knowledge of HBM, 2.5D integration, and 3D integration strategies including Hybrid bonding
- Hands-on process module engineering in Wafer Level Packaging or 3D stacking
- Experience in DRAM manufacturing and OSAT companies
Nice to have
- Understanding of DRAM wafer structure and process flows
- English proficiency with East Asian languages
- Patent inventions or published literature demonstrating innovation passion