$133,800 – $219,550
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Intel seeks a manager to lead a module development engineering team focused on next-generation wafer processing and packaging technologies. This role suits experienced engineering leaders who can drive cross-functional collaboration and technology strategy while developing their teams.
Our summary, not Intel’s wording. The full posting is on their site.
What they ask for
Required
- Bachelor's degree in engineering, Materials Science, Physics, or related field with 6+ years experience, or Master's degree with 4+ years, or PhD with 2+ years
- Leadership experience managing engineering teams in complex environments
- Expertise in optical characterization, scripting, statistics, data analytics, and problem solving
Nice to have
- Experience with metrology and defect inspection equipment
- Semiconductor fabrication or packaging technology background
- Advanced module engineering experience
- Technical leadership or metrology tool ownership experience
- Ability to synthesize conflicting data into actionable solutions
- Familiarity with wafer equipment, processes, or singulation techniques