$127,100 – $203,400
Listed on Broadcom Inc.’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Broadcom is seeking a packaging engineer to develop advanced integration technologies for AI chips, managing the roadmap and technical enablement of next-generation packages incorporating memory and processor dies. This role suits someone with deep expertise in 2.5D/3D packaging and HBM technology who can lead cross-functional development and manufacturing optimization.
Our summary, not Broadcom Inc.’s wording. The full posting is on their site.
What they ask for
Required
- M.S. in engineering or related field
- 10+ years post-degree experience in packaging technology development
- Experience with 2.5D/3D or HBM technology
- Experience managing reliability testing and qualification
- Experience with yield improvement
- Project management and teamwork skills
Nice to have
- Ph.D. in engineering (allows 7 years experience instead of 10)
- Technology innovation background
- Cross-functional team leadership