Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
NVIDIAfull time · Senior
$196,000 – $368,000
Listed on NVIDIA’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role shapes the fundamental physical limits of GPU design by analyzing power, thermal, and packaging constraints, then architecting cross-domain solutions that keep NVIDIA ahead of physics itself. You'll predict where manufacturing and silicon boundaries threaten competitiveness and redesign them entirely, working across electrical, mechanical, and manufacturing domains.
Our summary, not NVIDIA’s wording. The full posting is on their site.
What they ask for
Required
- BS/MS/PhD in EE, Physics, or CE or equivalent experience
- 12+ years relevant experience in high-performance GPU/CPU power and thermal systems
- Deep understanding of power delivery, thermal dissipation, and current density in GPUs/CPUs
- Proven ability to convert physical-limit trends into measurable solutions
- Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations
Nice to have
- Exceptional work ethic and ability to elevate technical discussions
- Native proficiency with AI tools for design exploration and modeling
- Experience solving problems spanning electrical, thermal, mechanical, and manufacturing domains simultaneously