$143,800 – $230,000
Listed on Broadcom Inc.’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Broadcom is seeking an experienced manager to lead a package design team working on complex flip-chip-BGA packages for AI, networking, and HPC ASICs. This role combines technical leadership in high-speed signal integrity and power delivery with people management, project oversight of 20+ concurrent designs, and cross-functional collaboration across global teams.
Our summary, not Broadcom Inc.’s wording. The full posting is on their site.
What they ask for
Required
- BSEE or MSEE degree
- 12+ years of flip-chip-BGA package design experience including high-speed SerDes
- 3+ years of management experience
- Knowledge of package-level signal integrity and power integrity
- Understanding of package design lifecycle and ASIC manufacturing flows
- Experience with design data formats (.mcm files, package spreadsheets, technical drawings)
- Familiarity with DFx trade-offs and layout considerations
- Ability to work on-site 5 days per week
Nice to have
- Previous experience managing people and projects
- Knowledge of mechanical and thermal modeling
- Experience with automation code development
- Exposure to new business quoting processes