$141,300 – $226,000
Listed on Broadcom Inc.’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Broadcom is hiring an engineer to design and lay out integrated circuit substrates and packages, focusing on high-speed signal routing and manufacturing specifications. This role suits experienced EDA professionals who want to work across the full lifecycle from design through fab evaluation.
Our summary, not Broadcom Inc.’s wording. The full posting is on their site.
What they ask for
Required
- Bachelor's degree in Material Science, Electrical, Computer, or Mechanical Engineering or related field plus 12 years of experience (or Master's plus 10 years, or PhD plus 7 years)
- Deep expertise with Cadence layout tools and EDA tools
- Understanding of multilayer high-speed RF design, package/substrate manufacturing processes and materials, and surface mount technology
- Design rule checking and layout vs schematic verification
- Cross-functional collaboration with mechanical, electrical, power/signal integrity engineers and project managers
Nice to have
- Script-based layout tool development
- Design simulation and improvement suggestions
- Substrate and package vendor coordination
- Post-fab evaluation including visual inspection and electrical characterization