$224,970 – $317,600
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role leads device engineering efforts for Intel's foundry operations, developing next-generation semiconductor process technology and collateral. It suits experienced CMOS device engineers who combine deep physics knowledge with cross-functional leadership and can bridge design, process, and yield disciplines.
Our summary, not Intel’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Master's degree in Electrical Engineering, Physics, or related field
- 15+ years CMOS device engineering experience with focus on test chip design and device collateral development
Nice to have
- Ph.D. in Electrical Engineering, Physics, or related field
- Advanced node test chip design experience (3nm-16nm FinFETs, sub-3nm GAA FETs)
- Design rule checker (DRC) development and physical verification flow experience
- High-Volume Manufacturing and yield monitoring experience
- Statistical process control (SPC) and advanced data analytics knowledge
- Mask generation knowledge including Boolean/OPC