$121,900 – $195,000
Listed on Broadcom Inc.’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Broadcom needs an experienced IC package engineer to design complex flip-chip BGA packages for high-performance ASICs used in AI, networking, and telecommunications. This role combines physical design layout with signal and power integrity analysis, managing multiple concurrent projects within a global team.
Our summary, not Broadcom Inc.’s wording. The full posting is on their site.
What they ask for
Required
- BSEE or equivalent degree with 8+ years flip-chip BGA package design experience (including high-speed SerDes), or MSEE with 6+ years experience
- Package-level signal integrity and power integrity knowledge
- On-site presence 5 days per week at Broadcom office
Nice to have
- Cadence APD (Allegro Package Designer) experience
- 1+ years experience with Cadence SKILL or similar design-automation coding
- Experience with 5G RF/Microwave, ADC/DAC, or HBM designs