Listed on Micron Technology’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
A research and development role focused on advancing mechanical wafer processing technologies for semiconductor memory products, particularly edge trim and backgrind processes. This position suits experienced process engineers who want to drive innovation in next-generation advanced packaging while solving complex material and defect challenges at scale.
Our summary, not Micron Technology’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Bachelor's or Master's degree
- 4+ years experience in wafer edge trim, backgrind, thinning, CMP, or mechanical wafer processing
- Demonstrated R&D capability with hands-on wafer processing advancement
- Expertise in experimental design, data analysis, and result interpretation
- Strong analytical and physics-based problem-solving for mechanical and material challenges
- Deep understanding of wafer thinning, backgrind, and edge trim process mechanics
- Proven success resolving complex process, yield, and reliability issues via root-cause analysis
- Self-motivated, capable of independent work with minimal supervision
- Ability to manage multiple projects simultaneously
- Strong MS Office and data visualization proficiency
Nice to have
- PhD in related field with 2+ years industry experience
- Proficiency in statistical process control and variability reduction
- Exposure to advanced packaging technologies such as wafer-level packaging, bonding/de-bonding, or 2.5D/3D integration
- Familiarity with Python scripting, automation, or GenAI-enabled analysis