$141,910 – $269,100
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role involves designing and developing semiconductor packaging solutions and materials, managing the complete packaging development lifecycle from concept through manufacturing scale-up. It suits engineers with deep expertise in packaging technology, thermal/mechanical design, and qualification testing who want to drive innovation in advanced semiconductor packaging.
Our summary, not Intel’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or related field with 6+ years relevant experience, or Master's degree with 4+ years experience, or PhD with 4+ years experience
- Packaging engineering and process development experience
- Thermal, mechanical, and electrical design concepts for semiconductor packaging
- Qualification testing, specification documentation, and packaging material certification expertise
Nice to have
- Advanced packaging technology development experience
- Strategic supplier management experience
- Hybrid bonding process development or integration experience
- Experience leading technology programs and engaging cross-functional stakeholders
- Participation in forums, task forces, or working groups focused on defect reduction and process improvements