Listed on Micron Technology’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This Staff-level role develops and optimizes semiconductor packaging equipment, taking ideas from conception through manufacturing implementation. It suits experienced engineers who enjoy working across hardware design, process optimization, and cross-functional collaboration with vendors and internal teams.
Our summary, not Micron Technology’s wording. The full posting is on their site.
Skills this role names
- Data Science
- Design of Experiments (DOE)
- Eight Disciplines Problem Solving (8D)
- Failure Analysis
- Failure Mode and Effects Analysis (FMEA)
- Robotics
- Root Cause Analysis
- Statistical Process Control (SPC)
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What they ask for
Required
- Master's degree or equivalent in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related field
- 2+ years semiconductor process or equipment engineering experience
- Fundamental understanding of post-probe and assembly process and equipment interactions
- Understanding of inline, electrical, and probe failure modes
- 2+ years experience with Design of Experiments, Statistical Process Control, Defect analysis, and data analysis
- Hands-on experience with wafer and assembly tools and overlay systems
- Ability to solve sophisticated problems through root-cause or model-based analysis
Nice to have
- Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field, or equivalent experience
- Knowledge of robotics, machine logic language, or new hardware design
- Wafer or die bonding, plating, warpage control, or packaging field experience