$141,300 – $226,000
Listed on Broadcom Inc.’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This is a principal-level mechanical engineering role focused on designing high-powered chassis and thermal solutions for ultra-high-performance electronics, requiring deep expertise in managing complex thermal and manufacturing challenges. The position suits experienced mechanical engineers comfortable with full lifecycle product ownership, cross-functional collaboration, and hands-on engagement with production and field validation.
Our summary, not Broadcom Inc.’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Bachelor's degree in Mechanical Engineering
- 12+ years of experience
- Design and development of high-powered production enclosures (2kW/RU+)
- Experience with power and thermal issues in high-density PCBs (1kW+ footprints)
- Collaboration with manufacturing and production teams on process optimization
- Knowledge of US, European, and Asian regulations and standards
- Full lifecycle product ownership from inception through volume production and field support
Nice to have
- Small team leadership or technical mentorship experience