$111,500 – $170,000
Listed on AeroVironment’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
This role designs and tests high-reliability RF printed circuit boards for radar and communications systems, managing the entire lifecycle from stack-up definition through manufacturing and production testing. It suits experienced RF engineers who can navigate complex mixed-signal layouts, collaborate with fabricators and test teams, and automate measurement workflows.
Our summary, not AeroVironment’s wording. The full posting is on their site.
Skills this role names
Log in to see which of these are already on your profile.
What they ask for
Required
- Bachelor's degree in electrical engineering or related field
- 8+ years RF/microwave and mixed-signal PCB development for high-reliability products
- Expertise in RF board layout for L/S/C/X/Ku/Ka-band front-ends
- Hybrid stack-up and controlled impedance design
- Backdrill and HDI strategies
- Proficiency with ECAD tools (Altium, Cadence, or Mentor)
- Proficiency with RF analysis tools (ADS, HFSS, SIwave, CST)
- RF measurement expertise (S-parameters, gain, noise figure, linearity, modulation metrics)
- Automation with Python and/or LabVIEW using SCPI/IVI
- Knowledge of IPC-2221/2223, IPC-6012, IPC-A-600/-610 Class 3
- Knowledge of ANSI/ESD S20.20 and environmental/EMI test practices
- DoD documentation practices
- Ability to obtain DoD Top-Secret/SCI clearance
- U.S. citizenship
Nice to have
- Master's degree
- Experience with phased-array TR modules or beamforming IC integrations
- Design for ruggedization and environmental screening
- Reliability analysis (derating, FMEA)
- PLM experience (Arena, Windchill)
- Manufacturing with domestic CMs
- mmWave packaging and RF connector/launch design
- Fixture design for S-parameter and over-the-air test
- IPC CID/CID+ certification
- Active Secret or Top Secret clearance