$211,400 – $298,440
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
A Principal Engineer role leading the development and manufacturing scale-up of hybrid bonding technology for advanced semiconductor packaging. This position suits experienced process engineers with deep expertise in wafer bonding, equipment development, and high-volume manufacturing who can drive innovation across chiplet and advanced packaging architectures.
Our summary, not Intel’s wording. The full posting is on their site.
Skills this role names
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What they ask for
Required
- Deep expertise in hybrid bonding or advanced packaging module development
- Proven industry experience in hybrid bonding equipment and process development
- Experience with first-of-a-kind platform development scaling to high-volume manufacturing
- Ability to translate technology roadmaps into executable strategies
- Experience identifying process and equipment limitations
- Experience operating across technology development and manufacturing environments
- Experience mentoring and developing senior technical talent
- Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field with 15+ years of experience, or Master's degree with 10+ years of experience, or PhD with 8+ years of experience
Nice to have
- Track record delivering first-of-a-kind hybrid bonding platforms to HVM with step-function improvements
- Experience with advanced packaging flows (chiplets, 2.5D/3D integration)
- Knowledge of equipment-process co-optimization and supplier engagement
- Knowledge of bond interface physics (Cu-Cu, dielectric bonding) and defect mechanisms
- Knowledge of defect reduction and contamination control challenges
- Knowledge of alignment/overlay critical processes and precision manufacturing