$70,480 – $179,090
Listed on Samsung Semiconductor’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Samsung is hiring a process engineer to oversee wafer bonding and de-bonding operations at their Austin semiconductor fab, managing equipment setup, troubleshooting process issues, and leading continuous improvement initiatives. This role suits someone with semiconductor manufacturing experience who can balance hands-on equipment management with cross-functional collaboration and technical problem-solving.
Our summary, not Samsung Semiconductor’s wording. The full posting is on their site.
Skills this role names
Log in to see which of these are already on your profile.
What they ask for
Required
- Bachelor's degree in Engineering or related technical discipline
- Minimum 5 years of engineering experience in fab equipment management
- Minimum 3 years of experience with wafer bonding and de-bonding equipment
- Experience in semiconductor environment or high-volume advanced manufacturing
- Ability to work in cleanroom environment for several hours daily
- Data analysis and visualization skills
- Project management and prioritization experience
- Team-oriented mindset
Nice to have
- Knowledge of semiconductor equipment systems (vacuum, RF, plasma, MFCs, pneumatic valves, recipes, safety)
- Ability to manipulate and interpret equipment sensor data for troubleshooting
- Programming experience with VBA, Python, R, or SQL