$115,110 – $188,890
Listed on Intel’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
Intel seeks an engineer to develop and optimize packaging and assembly processes for next-generation semiconductor solutions. This role suits someone with materials or mechanical engineering expertise who enjoys solving manufacturing challenges through design, testing, and cross-functional collaboration.
Our summary, not Intel’s wording. The full posting is on their site.
Skills this role names
- AutoCAD
- Design of Experiments (DOE)
- Geometric Dimensioning And Tolerancing
- SolidWorks
- Statistical Process Control (SPC)
Log in to see which of these are already on your profile.
What they ask for
Required
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 3+ years relevant experience, OR Master's degree with 2+ years experience, OR PhD with 6+ months experience
- Proficiency in Statistical Process Control and Design of Experiments
- Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
- Competency in mechanical design software such as SolidWorks or AutoCAD
Nice to have
- Proven ability to lead technical innovation and manage complex projects
- Understanding of semiconductor fabrication processes and packaging technologies
- Familiarity with supply chain management in manufacturing or materials qualification
- Experience with high-precision manufacturing methods including stamping and CNC machining