Listed on Micron Technology’s own careers site. You apply with them directly — we never stand between you and the employer.
What this role is
A coordination and execution lead role for high-bandwidth memory chip designs at Micron, overseeing the complex process of preparing designs for manufacturing handoff, managing schedules, and ensuring all technical and compliance requirements are met before release.
Our summary, not Micron Technology’s wording. The full posting is on their site.
What they ask for
Required
- Lead tapeout execution and release coordination for HBM designs
- Manage tapeout schedules and DBR milestones
- Prepare and review tapeout collateral (TOAST, RCDB, TWIT)
- Coordinate with teams to ensure release prerequisites are met
- Track and close signoff readiness items (timing, power, physical verification, integration)
- Ensure correctness and traceability of final databases and signoff evidence
- Track, document, and escalate waivers and release risks
- Maintain release discipline across HBM programs