# Senior Technologist, Hybrid Bonding Module

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/fa787e43-f72f-44aa-acb0-39800763012a

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Location: Hillsboro, OR
- Salary: 180770 – 255200 USD per year

## Summary

This role develops and optimizes die-to-wafer hybrid bonding processes and equipment for Intel's advanced semiconductor packaging technologies. It suits experienced process or equipment engineers with deep expertise in bonding, wafer joining, or similar advanced packaging domains who can lead development programs and drive manufacturing improvements.

_Our summary, not Intel's wording._

## Skills named

Design of Experiments (DOE), Failure Analysis, Materials science, Statistical Analysis, Thermal Management

## Required

- Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field plus 9+ years experience (or Master's plus 6+ years, or PhD plus 4+ years)
- 5+ years industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing

## Nice to have

- Experience leading first-of-a-kind process or equipment development programs
- Experience introducing new hybrid bonding platforms or manufacturing capabilities
- Knowledge of bond interface defect mechanisms and failure modes
- Experience with alignment-sensitive manufacturing and overlay optimization
- Experience with process characterization and defect inspection techniques
- Experience improving equipment capability and throughput in manufacturing
- Experience collaborating with external equipment suppliers and materials vendors
- Experience transferring technology from development to manufacturing

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Oregon-Hillsboro/Senior-Technologist--Hybrid-Bonding-Module_JR0284467