# Module Engineering - Day Shift 5 or 7

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/f7c1d902-3d97-444e-b7d2-42a49a3c9791

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Junior
- Location: Phoenix, AZ
- Salary: 85200 – 162500 USD per year

## Summary

Intel seeks a Module Engineer to design and optimize semiconductor packaging assembly processes and equipment for their foundry business. This role suits engineering graduates or experienced professionals with background in mechanical, materials, or chemical engineering who want to work on cutting-edge packaging technology in a manufacturing environment.

_Our summary, not Intel's wording._

## Skills named

Design of Experiments (DOE), Process Optimization, Statistical Process Control (SPC)

## Required

- US Citizenship
- Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or STEM field with 1+ years experience OR Master's degree in related field OR Associate degree with 12+ years engineering experience
- 6+ months experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE)

## Nice to have

- Prior experience in semiconductor manufacturing environment
- Experience with semiconductor packaging processes including assembly, materials, or reliability engineering in foundry context

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Arizona-Phoenix/Module-Engineering---Day-Shift-5-or-7_JR0285727