# Principal Engineer, APTD

Hiring organization: [Micron Technology](https://career.thegoodapps.co/organizations/micron-technology)

Canonical page: https://career.thegoodapps.co/jobs/ebceac6a-a289-4063-96c0-2a9d9de05c75

Listed on Micron Technology's own careers site. Applications go to them directly.

- Seniority: Principal
- Location: Boise, ID

## Summary

A Principal Engineer role shaping advanced semiconductor packaging technology roadmaps and investment priorities at Micron's Boise campus. This suits experienced packaging technologists who can balance technical innovation with business strategy and influence senior leadership on competitive positioning.

_Our summary, not Micron Technology's wording._

## Required

- Over 5 years in semiconductor advanced packaging
- BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or equivalent
- Deep knowledge of HBM, 2.5D integration, and 3D integration strategies including Hybrid bonding
- Hands-on process module engineering in Wafer Level Packaging or 3D stacking
- Experience in DRAM manufacturing and OSAT companies

## Nice to have

- Understanding of DRAM wafer structure and process flows
- English proficiency with East Asian languages
- Patent inventions or published literature demonstrating innovation passion

Apply on Micron Technology's site: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Boise-ID---Main-Site/Principal-Engineer-Advanced-Package-Technology-Development_JR95525