# Hybrid C2C  - BEOL Module Integration Engineer

Hiring organization: [Samsung Semiconductor](https://career.thegoodapps.co/organizations/samsung-semiconductor)

Canonical page: https://career.thegoodapps.co/jobs/e7c5a0e3-7d54-4240-a979-3320081677a1

Listed on Samsung Semiconductor's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Location: Austin, TX
- Salary: 106000 – 145000 USD per year

## Summary

Samsung is hiring a process engineer to lead the development and manufacturing integration of advanced copper-to-copper wafer bonding technology for stacked image sensors. This role suits someone with deep semiconductor manufacturing experience who can drive yield improvements and manage complex process interactions in a high-stakes fab environment.

_Our summary, not Samsung Semiconductor's wording._

## Skills named

Stable Diffusion

## Required

- Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
- 5+ years Far BEOL process or module integration experience in semiconductor manufacturing
- 3+ years bonding process experience
- Expert understanding of process flow interactions between process, yield, product performance and reliability

## Nice to have

- 10+ years process or module integration experience
- Prior knowledge of fab unit processes including lithography, etch, diffusion, thin films deposition, wet cleans and CMP

Apply on Samsung Semiconductor's site: https://sec.wd3.myworkdayjobs.com/en-US/Samsung_Careers/job/12100-Samsung-Blvd-Austin-TX-USA/C2C-Bonding-Engineer_R119383-1