# Advanced Packaging Development Engineer

Hiring organization: [Broadcom Inc.](https://career.thegoodapps.co/organizations/broadcom-inc)

Canonical page: https://career.thegoodapps.co/jobs/da58aed7-318f-4610-bf52-56b1a23796c1

Listed on Broadcom Inc.'s own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Location: Irvine, CA
- Salary: 127100 – 203400 USD per year

## Summary

Broadcom is seeking a packaging engineer to develop advanced integration technologies for AI chips, managing the roadmap and technical enablement of next-generation packages incorporating memory and processor dies. This role suits someone with deep expertise in 2.5D/3D packaging and HBM technology who can lead cross-functional development and manufacturing optimization.

_Our summary, not Broadcom Inc.'s wording._

## Required

- M.S. in engineering or related field
- 10+ years post-degree experience in packaging technology development
- Experience with 2.5D/3D or HBM technology
- Experience managing reliability testing and qualification
- Experience with yield improvement
- Project management and teamwork skills

## Nice to have

- Ph.D. in engineering (allows 7 years experience instead of 10)
- Technology innovation background
- Cross-functional team leadership

Apply on Broadcom Inc.'s site: https://broadcom.wd1.myworkdayjobs.com/en-US/External_Career/job/USA-CA-Irvine-Alton-Parkway-Bldg-2/Advanced-Packaging-Development-Engineer_R026099