# New College Grad - Mixed Signal Design Engineer, HBM

Hiring organization: [Micron Technology](https://career.thegoodapps.co/organizations/micron-technology)

Canonical page: https://career.thegoodapps.co/jobs/cd3a20f9-8750-41d2-bb06-e73c8a969bf4

Listed on Micron Technology's own careers site. Applications go to them directly.

- Seniority: Staff
- Location: Richardson, TX

## Summary

This role leads the physical design of Micron's high-bandwidth memory chips from initial schematic through final manufacturing data, owning placement, routing, timing closure, and power delivery across advanced process nodes. It suits experienced IC designers comfortable driving complex multi-team efforts in memory-centric designs and learning HBM-specific architecture if not already expert in it.

_Our summary, not Micron Technology's wording._

## Skills named

Python, Tcl

## Required

- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field
- 7+ years hands-on advanced-node physical design experience
- Tape-out experience on HBM, DRAM, or large memory-centric designs
- Expertise in floorplanning and hierarchical timing closure
- Power integrity and thermal design experience
- Physical signoff knowledge for advanced nodes
- Expert-level Cadence Innovus or Synopsys ICC2/Fusion Compiler
- Strong PrimeTime STA proficiency
- RedHawk or equivalent power integrity tool experience
- Calibre DRC/LVS and foundry signoff flow familiarity

## Nice to have

- Direct HBM2E, HBM3, or HBM3E product experience
- TSV-based design and micro-bump layout knowledge
- Die-to-die interface and wide parallel bus experience
- Advanced packaging understanding (2.5D interposer, chiplets)
- FinFET and sub-10nm node experience
- Tcl or Python scripting for physical design automation

Apply on Micron Technology's site: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Richardson-TX/Staff-Physical-Design-Engineer--HBM_JR106821