# Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

Hiring organization: [NVIDIA](https://career.thegoodapps.co/organizations/nvidia)

Canonical page: https://career.thegoodapps.co/jobs/c6c5dffc-fc97-4c04-b104-3a2b91229147

Listed on NVIDIA's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Salary: 196000 – 368000 USD per year

## Summary

This role shapes the fundamental physical limits of GPU design by analyzing power, thermal, and packaging constraints, then architecting cross-domain solutions that keep NVIDIA ahead of physics itself. You'll predict where manufacturing and silicon boundaries threaten competitiveness and redesign them entirely, working across electrical, mechanical, and manufacturing domains.

_Our summary, not NVIDIA's wording._

## Required

- BS/MS/PhD in EE, Physics, or CE or equivalent experience
- 12+ years relevant experience in high-performance GPU/CPU power and thermal systems
- Deep understanding of power delivery, thermal dissipation, and current density in GPUs/CPUs
- Proven ability to convert physical-limit trends into measurable solutions
- Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations

## Nice to have

- Exceptional work ethic and ability to elevate technical discussions
- Native proficiency with AI tools for design exploration and modeling
- Experience solving problems spanning electrical, thermal, mechanical, and manufacturing domains simultaneously

Apply on NVIDIA's site: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/US-CA-Santa-Clara/Senior-System-and-Manufacturing-CoDesign-Architect---Power--Thermal-and-Packaging_JR2021453