# IC Package Mechanical FEA Engineer (R&D)

Hiring organization: [Broadcom Inc.](https://career.thegoodapps.co/organizations/broadcom-inc)

Canonical page: https://career.thegoodapps.co/jobs/c1922ad2-3419-4813-886f-0f391394db7e

Listed on Broadcom Inc.'s own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Mid
- Salary: 108000 – 172800 USD per year

## Summary

Broadcom is hiring a mechanical engineer to design and validate complex semiconductor packages using FEA simulation, working on cutting-edge AI and networking ASICs. This role suits engineers with deep expertise in thermal and mechanical analysis who can balance competing engineering constraints across multiple concurrent projects.

_Our summary, not Broadcom Inc.'s wording._

## Skills named

ANSYS, Finite Element Analysis (FEA)

## Required

- Bachelor's in Mechanical Engineering with 8+ years FEA experience, or Master's with 6+ years, or PhD with 3+ years
- Evaluate simulation results against first principles
- Calibrate models against empirical data
- Perform mechanical testing and measurement
- Devise and execute validation tests
- Cooperate across worldwide teams and time zones
- Self-management and organization skills

## Nice to have

- Ansys Classic/Mechanical experience

Apply on Broadcom Inc.'s site: https://broadcom.wd1.myworkdayjobs.com/en-US/External_Career/job/USA-Colorado-Fort-Collins-4380-Ziegler-Road/IC-Package-Mechanical-FEA-Engineer--R-D-_R024441-2