# Package Failure Analysis Engineer

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/ba09f7c2-d3f8-4b01-b481-67fff9fdd482

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Junior
- Location: Phoenix, AZ
- Salary: 85200 – 139810 USD per year

## Summary

This role investigates why semiconductor packages fail during manufacturing and testing, determining root causes to improve production yield. It suits engineers who enjoy hands-on lab work, can troubleshoot complex electrical and material problems, and want to collaborate across teams on a shift-based schedule.

_Our summary, not Intel's wording._

## Skills named

SEM

## Required

- Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or related field
- US Citizenship
- Ability to obtain and maintain US Government TS/SCI Security Clearance with Polygraph
- Hands-on experience with electrical fault isolation or defect characterization techniques
- Willingness to work Shift 5 schedule (Sunday-Tuesday AM-PM, alternating Wednesday days)
- On-site lab work in Phoenix, Arizona

## Nice to have

- Active US Government TS/SCI Security Clearance with Polygraph
- Prior lab experience in academic or professional setting
- Familiarity with optical analysis techniques (SEM, TEM, x-ray, optical microscopy)
- Background in electrical circuits through coursework or hands-on experience with testing equipment
- Experience with chemical compositional analysis techniques (EDX, AFM, FTIR, Raman, XRD, EBSD)
- Proficiency with CAD software and statistical analysis tools like JMP
- Strong verbal and written communication skills
- Ability to work collaboratively in fast-paced, ambiguous environments

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Arizona-Phoenix/Package-Failure-Analysis-Engineer_JR0285289