# ASIC Package Design Manager

Hiring organization: [Broadcom Inc.](https://career.thegoodapps.co/organizations/broadcom-inc)

Canonical page: https://career.thegoodapps.co/jobs/b64bf094-1bec-4afb-9ba2-a34aa58fc48f

Listed on Broadcom Inc.'s own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Location: Fort Collins, CO
- Salary: 143800 – 230000 USD per year

## Summary

Broadcom is seeking an experienced manager to lead a package design team working on complex flip-chip-BGA packages for AI, networking, and HPC ASICs. This role combines technical leadership in high-speed signal integrity and power delivery with people management, project oversight of 20+ concurrent designs, and cross-functional collaboration across global teams.

_Our summary, not Broadcom Inc.'s wording._

## Skills named

Project Management

## Required

- BSEE or MSEE degree
- 12+ years of flip-chip-BGA package design experience including high-speed SerDes
- 3+ years of management experience
- Knowledge of package-level signal integrity and power integrity
- Understanding of package design lifecycle and ASIC manufacturing flows
- Experience with design data formats (.mcm files, package spreadsheets, technical drawings)
- Familiarity with DFx trade-offs and layout considerations
- Ability to work on-site 5 days per week

## Nice to have

- Previous experience managing people and projects
- Knowledge of mechanical and thermal modeling
- Experience with automation code development
- Exposure to new business quoting processes

Apply on Broadcom Inc.'s site: https://broadcom.wd1.myworkdayjobs.com/en-US/External_Career/job/USA-Colorado-Fort-Collins-4380-Ziegler-Road/ASIC-Package-Design-Manager_R026605-4