# Substrate/Package Layout Engineer

Hiring organization: [Broadcom Inc.](https://career.thegoodapps.co/organizations/broadcom-inc)

Canonical page: https://career.thegoodapps.co/jobs/a8b6a754-6623-450a-b8dc-8b16ffc27e56

Listed on Broadcom Inc.'s own careers site. Applications go to them directly.

- Seniority: Senior
- Location: San Jose, CA
- Salary: 141300 – 226000 USD per year

## Summary

Broadcom is hiring an engineer to design and lay out integrated circuit substrates and packages, focusing on high-speed signal routing and manufacturing specifications. This role suits experienced EDA professionals who want to work across the full lifecycle from design through fab evaluation.

_Our summary, not Broadcom Inc.'s wording._

## Required

- Bachelor's degree in Material Science, Electrical, Computer, or Mechanical Engineering or related field plus 12 years of experience (or Master's plus 10 years, or PhD plus 7 years)
- Deep expertise with Cadence layout tools and EDA tools
- Understanding of multilayer high-speed RF design, package/substrate manufacturing processes and materials, and surface mount technology
- Design rule checking and layout vs schematic verification
- Cross-functional collaboration with mechanical, electrical, power/signal integrity engineers and project managers

## Nice to have

- Script-based layout tool development
- Design simulation and improvement suggestions
- Substrate and package vendor coordination
- Post-fab evaluation including visual inspection and electrical characterization

Apply on Broadcom Inc.'s site: https://broadcom.wd1.myworkdayjobs.com/en-US/External_Career/job/USA-California-San-Jose-1320-Ridder-Park-Drive/Substrate-Package-Layout-Engineer_R025810-1