# Senior Package Layout Engineer - Hardware

Hiring organization: [NVIDIA](https://career.thegoodapps.co/organizations/nvidia)

Canonical page: https://career.thegoodapps.co/jobs/a3865e73-2448-40c0-80d6-d971e31eae48

Listed on NVIDIA's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Salary: 136000 – 212750 USD per year

## Summary

This role designs the physical layouts of semiconductor package substrates for NVIDIA's GPUs and AI chips, optimizing for signal integrity, power delivery, and manufacturability. It suits experienced PCB and substrate layout engineers with a background in high-density designs and Cadence tools who want to work on cutting-edge hardware at scale.

_Our summary, not NVIDIA's wording._

## Required

- Bachelor's degree in Electrical Engineering or equivalent experience
- 5+ years PCB layout experience with graphics cards, motherboards, or line cards
- Substrate layout experience with wire bond and flip chip packages
- Proficiency with Cadence APD or SiP and PCB layout tools
- Understanding of high-speed signal integrity design

## Nice to have

- HDI design experience
- Virtuoso and Calibre experience
- Valor tool experience

Apply on NVIDIA's site: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/US-CA-Santa-Clara/Senior-Package-Layout-Engineer---Hardware_JR2022910-1