# Package Design Engineer

Hiring organization: [Broadcom Inc.](https://career.thegoodapps.co/organizations/broadcom-inc)

Canonical page: https://career.thegoodapps.co/jobs/90f1fa1c-ae91-4629-8b8e-d99c52708584

Listed on Broadcom Inc.'s own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Salary: 121900 – 195000 USD per year

## Summary

Broadcom needs an experienced IC package engineer to design complex flip-chip BGA packages for high-performance ASICs used in AI, networking, and telecommunications. This role combines physical design layout with signal and power integrity analysis, managing multiple concurrent projects within a global team.

_Our summary, not Broadcom Inc.'s wording._

## Required

- BSEE or equivalent degree with 8+ years flip-chip BGA package design experience (including high-speed SerDes), or MSEE with 6+ years experience
- Package-level signal integrity and power integrity knowledge
- On-site presence 5 days per week at Broadcom office

## Nice to have

- Cadence APD (Allegro Package Designer) experience
- 1+ years experience with Cadence SKILL or similar design-automation coding
- Experience with 5G RF/Microwave, ADC/DAC, or HBM designs

Apply on Broadcom Inc.'s site: https://broadcom.wd1.myworkdayjobs.com/en-US/External_Career/job/USA-CA-San-Jose-Innovation-Drive/Package-Design-Engineer_R026631