# New College Grad - Product Yield Enhancement Engineer, HBM

Hiring organization: [Micron Technology](https://career.thegoodapps.co/organizations/micron-technology)

Canonical page: https://career.thegoodapps.co/jobs/8c1e9258-7c75-42c5-a706-47ff350e1484

Listed on Micron Technology's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Entry
- Location: Boise, ID

## Summary

This role involves analyzing failures in high-bandwidth memory products through electrical and physical testing techniques to identify manufacturing root causes and support production ramp. It suits recent graduates in engineering or materials science who want to launch a career in semiconductor yield engineering with hands-on experience in fault isolation and process improvement.

_Our summary, not Micron Technology's wording._

## Skills named

Bash (Scripting), Tcl

## Required

- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry, or equivalent practical experience
- 0–2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis
- Experience with CAD including layout and schematic analysis
- Understanding of semiconductor device physics and VLSI design principles
- Scripting proficiency in UNIX/Linux environments

## Nice to have

- Hands-on fault isolation and failure analysis techniques
- Understanding of both physical and logical semiconductor design
- Knowledge of semiconductor packaging, assembly, and fabrication workflows
- Experience in reliability engineering and quality analysis methodologies
- Experience with AI-assisted analytics for yield improvement

Apply on Micron Technology's site: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Boise-ID---Main-Site/New-College-Grad---Product-Yield-Enhancement-Engineer--HBM_JR104805