# Foveros Direct Pathfinding Integration

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/72a1b598-b3ac-4123-9bf5-a4c8865b1a5d

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Senior
- Salary: 141910 – 269100 USD per year

## Summary

This role involves designing and developing semiconductor packaging solutions and materials, managing the complete packaging development lifecycle from concept through manufacturing scale-up. It suits engineers with deep expertise in packaging technology, thermal/mechanical design, and qualification testing who want to drive innovation in advanced semiconductor packaging.

_Our summary, not Intel's wording._

## Skills named

Electrical Design, Materials science, Mechanical Design, Process Development

## Required

- Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or related field with 6+ years relevant experience, or Master's degree with 4+ years experience, or PhD with 4+ years experience
- Packaging engineering and process development experience
- Thermal, mechanical, and electrical design concepts for semiconductor packaging
- Qualification testing, specification documentation, and packaging material certification expertise

## Nice to have

- Advanced packaging technology development experience
- Strategic supplier management experience
- Hybrid bonding process development or integration experience
- Experience leading technology programs and engaging cross-functional stakeholders
- Participation in forums, task forces, or working groups focused on defect reduction and process improvements

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Oregon-Hillsboro/Foveros-Direct-Pathfinding-Integration_JR0282837