# Staff Chemical Mechanical Planarization (CMP) Engineer

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/667de85d-1131-4b27-b2d8-10ff45f0944c

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Staff
- Location: Hillsboro, OR
- Salary: 133800 – 255200 USD per year

## Summary

This role leads chemical mechanical planarization process development and optimization across Intel's most advanced semiconductor technology nodes, from research through high-volume manufacturing. It suits experienced process engineers who can combine deep CMP expertise with cross-functional leadership and the ability to translate complex technical challenges into manufacturing solutions.

_Our summary, not Intel's wording._

## Skills named

Process Control

## Required

- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- 5+ years of semiconductor manufacturing or process development experience
- 3+ years of direct CMP process development with hands-on process tuning and characterization
- Experience with major CMP equipment platforms (AMAT, Ebara, or equivalent)
- Experience with CMP consumables (slurries, pads, conditioning disks, filters, clean chemistries)
- Prior semiconductor foundry experience

## Nice to have

- Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field
- Experience with advanced technology nodes (sub-10nm logic, Gate All Around architectures) and successful HVM implementation
- Cross-functional leadership experience including yield improvement task forces
- Experience integrating CMP with other process modules (deposition, lithography, etch, clean)
- Understanding of CMP impact on device performance and yield

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Oregon-Hillsboro/Staff-Chemical-Mechanical-Planarization--CMP--Engineer_JR0285228