# Dry Etch module development engineer

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/3eb4d129-3b92-42fd-9b98-e76c0bf0fcf7

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Mid
- Location: Hillsboro, OR
- Salary: 133800 – 255200 USD per year

## Summary

This role involves developing and optimizing plasma dry etch processes for advanced semiconductor manufacturing, working with equipment suppliers and cross-functional teams to solve complex technical challenges and enable high-volume production. It suits experienced process engineers or materials scientists who have shipped dry etch solutions at foundries or equipment makers and want to drive technology roadmaps at scale.

_Our summary, not Intel's wording._

## Skills named

Design of Experiments (DOE), MATLAB, Python, SEM, Statistical Analysis

## Required

- PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering or related STEM with 4+ years dry etch experience at foundry or equipment supplier, OR Master's with 6+ years experience, OR Bachelor's with 8+ years experience
- Hands-on dry etch semiconductor manufacturing experience with process development ownership
- Strong understanding of plasma etch fundamentals including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms
- Record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability at advanced technology nodes

## Nice to have

- 5+ years directly developing and deploying dry etch processes for advanced logic or foundry technologies
- Experience with advanced dry etch technologies such as ICP/CCP, HARC, ALE, radical and vapor phase isotropic etching, ash and surface treatments, or EUV patterned layer etch integration
- Demonstrated ability to manage complex process challenges including pattern fidelity, CD control, defectivity, variability reduction, or process window expansion
- Understanding of logic BEOL interconnects and etch integration requirements
- Experience with materials and device characterization techniques
- Ability to define technical approaches and guide less senior engineers through complex problem solving
- Proven technical leadership across projects influencing peers and stakeholders
- Evidence of technical influence such as internal disclosures, patents, publications, or recognized expertise
- Strong collaboration and cross-disciplinary communication skills

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Oregon-Hillsboro/Dry-Etch-module-development-engineer_JR0285577