# Packaging Module Development Engineer

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/3608de31-00c5-4a49-bbdc-d3d6afe67b2a

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Mid
- Location: Phoenix, AZ
- Salary: 133800 – 188890 USD per year

## Summary

This role develops and maintains measurement systems for advanced packaging technologies at Intel, focusing on improving process control and yield through metrology expertise. It suits engineers with backgrounds in metrology, instrumentation, or optical systems who want to apply manufacturing data analytics to semiconductor production challenges.

_Our summary, not Intel's wording._

## Skills named

Design of Experiments (DOE), Measurement System Analysis (MSA), Microsoft Excel, Python, SQL, Statistical Analysis

## Required

- Bachelor's degree in engineering, physics, metrology, instrumentation, optical engineering, or related field with 4+ years experience (or Master's with 3+ years, or PhD with 1+ years)
- 1+ years hands-on experience in metrology systems development, equipment qualification, calibration, or measurement method development
- 2+ years knowledge of measurement system analysis including bias, linearity, stability, repeatability, and reproducibility
- 2+ years experience with electrical measurements and test such as continuity, resistance, leakage, or parametric test methods
- 2+ years experience with optical metrology including microscopes, imaging systems, or inspection methods
- 2+ years working knowledge of data analysis tools such as Python, Excel, SQL, or similar

## Nice to have

- Experience in semiconductor manufacturing, preferably advanced packaging
- Experience developing or sustaining metrology systems for process control or product qualification
- Strong background in equipment selection, tool qualification, acceptance testing, and calibration traceability
- Experience with machine vision systems, automated inspection, or camera-based measurement techniques
- Familiarity with lab-to-factory correlation and cross-tool measurement agreement studies
- Experience with design of experiments, correlation analysis, and method optimization
- Knowledge of quality systems, measurement documentation, and standardization of metrology methods
- Experience working with external suppliers, vendors, or calibration service providers
- Demonstrated ability to analyze measurement data using statistical methods to identify variation and root causes

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0286214