# Packaging Module Equipment Development Engineer

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/23f08746-1323-4767-833c-370aa2826993

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Mid
- Location: Phoenix, AZ
- Salary: 99030 – 188890 USD per year

## Summary

Intel seeks an engineer to develop and optimize assembly packaging equipment and processes for semiconductor manufacturing, working with Design of Experiments and statistical methods to improve efficiency and product reliability. This role suits candidates with materials, mechanical, or related engineering backgrounds who want to contribute to advanced manufacturing technology at scale.

_Our summary, not Intel's wording._

## Skills named

Design of Experiments (DOE), Statistical Process Control (SPC)

## Required

- US Citizenship
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years relevant experience, OR Master's degree with 1+ years experience, OR PhD
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE)

## Nice to have

- Lead technical innovation and manage complex time-sensitive projects
- High-volume manufacturing experience including equipment troubleshooting and change qualification
- Understanding of semiconductor fabrication processes and packaging technologies
- Familiarity with equipment install and qualification
- Experience optimizing procedures or designs for safety, quality, or cost-effective manufacturability

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Arizona-Phoenix/Packaging-Module-Equipment-Development-Engineer_JR0286445