# Principal Engineer, Hybrid Bonding Module

Hiring organization: [Intel](https://career.thegoodapps.co/organizations/intel)

Canonical page: https://career.thegoodapps.co/jobs/146bb129-b078-457b-9faa-9c7baee00e12

Listed on Intel's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Principal
- Location: Hillsboro, OR
- Salary: 211400 – 298440 USD per year

## Summary

A Principal Engineer role leading the development and manufacturing scale-up of hybrid bonding technology for advanced semiconductor packaging. This position suits experienced process engineers with deep expertise in wafer bonding, equipment development, and high-volume manufacturing who can drive innovation across chiplet and advanced packaging architectures.

_Our summary, not Intel's wording._

## Skills named

Materials science, Process Development, Reliability Engineering

## Required

- Deep expertise in hybrid bonding or advanced packaging module development
- Proven industry experience in hybrid bonding equipment and process development
- Experience with first-of-a-kind platform development scaling to high-volume manufacturing
- Ability to translate technology roadmaps into executable strategies
- Experience identifying process and equipment limitations
- Experience operating across technology development and manufacturing environments
- Experience mentoring and developing senior technical talent
- Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field with 15+ years of experience, or Master's degree with 10+ years of experience, or PhD with 8+ years of experience

## Nice to have

- Track record delivering first-of-a-kind hybrid bonding platforms to HVM with step-function improvements
- Experience with advanced packaging flows (chiplets, 2.5D/3D integration)
- Knowledge of equipment-process co-optimization and supplier engagement
- Knowledge of bond interface physics (Cu-Cu, dielectric bonding) and defect mechanisms
- Knowledge of defect reduction and contamination control challenges
- Knowledge of alignment/overlay critical processes and precision manufacturing

Apply on Intel's site: https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-Oregon-Hillsboro/Principal-Engineer--Hybrid-Bonding-Module_JR0284466