# CVD Process Engineer - Wafer Bonding

Hiring organization: [Samsung Semiconductor](https://career.thegoodapps.co/organizations/samsung-semiconductor)

Canonical page: https://career.thegoodapps.co/jobs/0f8f8a76-9f7e-425a-92bf-102157eab90c

Listed on Samsung Semiconductor's own careers site. Applications go to them directly.

- Employment type: full time
- Seniority: Mid
- Location: Austin, TX
- Salary: 70480 – 179090 USD per year

## Summary

Samsung is hiring a process engineer to oversee wafer bonding and de-bonding operations at their Austin semiconductor fab, managing equipment setup, troubleshooting process issues, and leading continuous improvement initiatives. This role suits someone with semiconductor manufacturing experience who can balance hands-on equipment management with cross-functional collaboration and technical problem-solving.

_Our summary, not Samsung Semiconductor's wording._

## Skills named

Data Analysis, Failure Mode and Effects Analysis (FMEA), Python, R, SQL, VBA

## Required

- Bachelor's degree in Engineering or related technical discipline
- Minimum 5 years of engineering experience in fab equipment management
- Minimum 3 years of experience with wafer bonding and de-bonding equipment
- Experience in semiconductor environment or high-volume advanced manufacturing
- Ability to work in cleanroom environment for several hours daily
- Data analysis and visualization skills
- Project management and prioritization experience
- Team-oriented mindset

## Nice to have

- Knowledge of semiconductor equipment systems (vacuum, RF, plasma, MFCs, pneumatic valves, recipes, safety)
- Ability to manipulate and interpret equipment sensor data for troubleshooting
- Programming experience with VBA, Python, R, or SQL

Apply on Samsung Semiconductor's site: https://sec.wd3.myworkdayjobs.com/en-US/Samsung_Careers/job/12100-Samsung-Blvd-Austin-TX-USA/CVD-Process-Engineer---Wafer-Bonding_R108276-1